MICRON · EMCP · Exact part
MT29VZZZAD9GUFSM-046 W.213
Official Micron catalog verifies eMCP TLC LPDDR4, total component density 1056Gb, package and lifecycle. The public row does not directly split total density into eMMC storage + DRAM, so the app does not fabricate that split.
Identity & specification
| Part number | MT29VZZZAD9GUFSM-046 W.213 |
|---|---|
| Manufacturer | MICRON |
| Record type | Exact part |
| Top marking | Not established |
| Aliases | Not established |
| Storage type | EMCP |
| Capacity | Not established |
| RAM | LPDDR4 |
| Protocol | eMMC-based MCP (exact eMMC revision not stated in public catalog row) |
| Package | 254 FBGA |
| Ball count | 254 |
| Pinout family | Not established |
| Voltage notes | I/O voltage 1.2V |
| Observed in devices | Not established |
Evidence
Official vendor
Source: Micron official e.MMC-based MCP part catalog
Verification status: official_identity_package_total_density_split_capacity_not_vendor_proven
Source score 0.99 — dataset metadata, not a probability of fitment.
Screening data incomplete
- ✓ Exact identity from a strong source
- ✗ Capacity
- ✗ Protocol version
- ✓ Ball count
- ✗ RAM size
- ✓ No open conflict
Verify CID/EXT_CSD for eMMC or UFS descriptors/LU geometry/RPMB for UFS before donor substitution.
A matching part number or package does not prove donor compatibility. Before replacement confirm the ball map, VCC/VCCQ, protocol generation, capacity geometry, DRAM training (MCP), CID/EXT_CSD or UFS descriptors, RPMB and OEM provisioning.