SAMSUNG · EMCP · Exact part
KMFN60012B-B214
V17 cross-reference: cross_checked_public_table; Vendor/distributor public tables.
Identity & specification
| Part number | KMFN60012B-B214 |
|---|---|
| Manufacturer | SAMSUNG |
| Record type | Exact part |
| Top marking | Same as part number (per source) |
| Aliases | KMFN60012B |
| Storage type | EMCP |
| Capacity | 8 GB |
| RAM | 1 GB LPDDR3 |
| Protocol | eMMC 5.1 |
| Package | FBGA-221 |
| Ball count | 221 |
| Pinout family | EMCP_BGA221 |
| Voltage notes | Not established |
| Observed in devices | Not established |
Evidence
Distributor
Source: Xunfenda eMCP component catalog
Verification status: curated_reference
Source score 0.86 — dataset metadata, not a probability of fitment.
Screening data complete
- ✓ Exact identity from a strong source
- ✓ Capacity
- ✓ Protocol version
- ✓ Ball count
- ✓ RAM size
- ✓ No open conflict
Do not treat same capacity/BGA as a drop-in donor; verify pin map, DRAM training, CID/EXT_CSD and board support.
A matching part number or package does not prove donor compatibility. Before replacement confirm the ball map, VCC/VCCQ, protocol generation, capacity geometry, DRAM training (MCP), CID/EXT_CSD or UFS descriptors, RPMB and OEM provisioning.