SAMSUNG · EMMC · Exact part
KLM8G1GESD-B03P
No additional notes in the dataset.
Identity & specification
| Part number | KLM8G1GESD-B03P |
|---|---|
| Manufacturer | SAMSUNG |
| Record type | Exact part |
| Top marking | Not established |
| Aliases | KLM8G1GESD-B03P,KLM8G1GESD |
| Storage type | EMMC |
| Capacity | 8 GB |
| RAM | Discrete / No RAM |
| Protocol | eMMC 5.0 |
| Package | FBGA-153 |
| Ball count | 153 |
| Pinout family | EMMC_BGA153 |
| Voltage notes | 1.8/3.3V interface variants; exact rail support is suffix/package dependent. |
| Observed in devices | Not established |
Evidence
Distributor
Source: Xunfenda Samsung eMMC catalog
Verification status: curated_reference
Source score 0.86 — dataset metadata, not a probability of fitment.
Screening data complete
- ✓ Exact identity from a strong source
- ✓ Capacity
- ✓ Protocol version
- ✓ Ball count
- ✓ No open conflict
Verify CID/EXT_CSD, boot partitions, write protection and RPMB.
A matching part number or package does not prove donor compatibility. Before replacement confirm the ball map, VCC/VCCQ, protocol generation, capacity geometry, DRAM training (MCP), CID/EXT_CSD or UFS descriptors, RPMB and OEM provisioning.