Do not assume MLCC by default
The load can be a capacitor, IC, connector branch or downstream subsystem. Thermal localization must identify the actual heating element.
Separate battery feed, VDD_MAIN, always-on rails, clock/reset, AP multi-phase bucks, DRAM/NAND rails and PMU latch behavior before injecting, splitting a board or replacing the PMIC.
Current draw is only one clue. The strongest diagnosis combines rail presence, timing, load behavior, known-good comparison and the exact boot stage.
Select a power domain to narrow the rail database and diagnostic interpretation.
V2 separates direct observation from likely cause and requires proof before component removal.
The source contains useful ceiling references, but V2 treats them as page references—not permission to inject automatically.
| Rail Family | Source Operating Range | Source Ceiling | Primary Risk | V2 Rule |
|---|---|---|---|---|
| PP_VDD_MAIN / VDD_BOOST | 3.8–4.3V | 3.8V source ceiling | Feeding sensitive branches / excessive heating | Confirm exact shorted rail, isolate battery/charger path, start well below nominal and current-limit. |
| PP_CPU_CORE / GPU_CORE | ~0.7–0.95V | 0.90V source ceiling | Permanent AP damage from over-voltage | Low resistance can be normal. Never apply main-rail voltage to core rails. |
| PP1V8_AON | ~1.8V | 1.8V source ceiling | Back-feeding PMU / always-on logic | Prefer resistance/isolation first; inject only after topology and max voltage are confirmed. |
| DRAM / memory rails | ~1.1V class | 1.15V source ceiling | Memory/AP damage | Do not treat low Ω as a short without exact-model known-good comparison. |
| Clock / crystal nodes | Bias / AC waveform | DO NOT INJECT | Oscillator / SoC damage | Use oscilloscope, not voltage injection. |
Source-derived references are preserved as bench references. Exact-model schematic/boardview and known-good measurements take precedence.
| Domain | Rail / Signal | Source Voltage | Source GR | Resistance | Source Injection Guidance | Interpretation |
|---|
Dynamic rail behavior, boot timing and exact-model reference remain essential.
V2 keeps the useful source structure while downgrading unsupported one-to-one conclusions.
The load can be a capacitor, IC, connector branch or downstream subsystem. Thermal localization must identify the actual heating element.
Confirm PMIC input, rail short, enable/state, interposer connection and load before replacing the PMIC.
Clock, AP execution, reset logic, power-hold state, interposer and rail collapse can all produce similar current behavior.
Core rails are inherently low impedance. Exact-model known-good comparison and source-current behavior are mandatory.
Capture actual VCORE droop, battery/main-rail sag and thermal state under the failing workload.
A rail can be correct at idle yet fail during ramp, clock/reset transition or high-current load.
Preserve exact model, power source, current curve, rail values, injection conditions and thermal result.